Citation

Bridgman H, Kwong MT, Bergmann JHM. Ann. Biomed. Eng. 2019; 47(8): 1725-1737.

Affiliation

Natural Interactions Lab, Oxford Institute of Biomedical Engineering, Department of Engineering Science, University of Oxford, Old Road Campus Research Building, Oxford, OX3 7DQ, UK. jeroen.bergmann@eng.ox.ac.uk.

Copyright

(Copyright © 2019, Holtzbrinck Springer Nature Publishing Group)

DOI

10.1007/s10439-019-02267-4

PMID

31025132

Abstract

The growing popularity of contact sports drives the requirement for better design of protective equipment, such as mouthguards. Smart mouthguards with embedded electronics provide a multitude of new ways to provide increased safety and protection to users. Characterisation of how electronic components embedded in typical mouthguard material, ethylene vinyl acetate (EVA), behave under typical sports impacts is crucial for future designs. A novel pendulum impact rig using a hockey ball disc impactor was developed to investigate impact forces and component failure. Two sets of dental models (aluminium and plastic padding chemical metal) were used to manufacture post-thermoformed mouthguards. Seven embedding conditions with varying thickness of EVA (1.5 and 3 mm) and locations of electrical components were tested. Component failures were observed in four out of seven test conditions, and the experimental failure forces at which the electrical component had a 50% chance of failure were reported for those cases. The experimental results showed that an EVA thickness of 3 mm surrounding the electrical component gives the most comprehensive protection even under extreme surface conformity. Computational models on surface conformity of EVA showed that a block of EVA with a minimum thickness of 1.5 mm was better at reducing stress concentration than a shell with an overall thickness of 1.5 mm. This study demonstrated that the thickness of a mouthguard is important when protecting electrical components from extreme dental surface conformity, furthermore the surface geometry should not be overlooked when considering electrical component safety for in-body wearables that are impact prone.

Language: en

Keywords

Embedded electronics; FEM; Impact; Mechanical assessment; Thermoformed