Citation

Lin CP, Chang HK, Chang YM, Chen SW, Shu CM. Process. Saf. Environ. Prot. 2009; 87(6): 353-360.

Copyright

(Copyright © 2009, Institution of Chemical Engineers and European Federation of Chemical Engineering, Publisher Hemisphere Publishing)

DOI

10.1016/j.psep.2009.07.005

PMID

unavailable

Abstract

In the past two decades, there has been continuous investment and expansion of semiconductor, photoelectric panel, or solar cell plants in the high-tech industry. For example, establishing a semiconductor plant costs about US$ 3 billion. In addition, the output value of integrated circuits (IC) of Taiwan as a whole is estimated to be about US$ 5.215 billion, and globally of US$ 275.2 billion in 2008. A large amount and a variety of specialty gases or chemicals are applied during processes in high-tech facilities and these chemicals are characterized by inflammability, toxicity, and corrosiveness. Accidents may result once errors or leaks occur in any part of the supply chain, which consists of storage facilities, supply equipment, process machines, and tail gas elimination devices. Personnel casualties can result in serious situations. This study discusses the emergency response procedures and common response defects in semiconductor plants with a view to enhancing emergency response effects and capabilities, avoiding casualties, reducing property loss and shortening operation interruption.